The MEMS array is available for customized applications.

AFA Controls can design and build a customized housing using the MEMS Array in a "First Level Package" format. This packaging concept is also available to Original Equipment Manufacturers who want to construct their own housing.

The standard "First Level Package" includes one MEMS array and the electronic module to control it. A single electronic module can operate up to four "First Level Package" components.

Specifications: Maximum Depth .16", Width .46", Height .49" - Flow .022Cv (.30scfm) @ 50psig.  

All request will require application review and approval by AFA Control's Engineering Department.